Members of Program Committee 2022

• J. Alt, Infineon Technologies AG
• W. Anheier, University of Bremen
• B. Becker, University of Freiburg
• R. Drechsler, University of Bremen and DFKI GmbH
• S. Eggersglüß, Siemens Digital Industries Software
• P. Engelke, Infineon Technologies AG
• G. Fey, Hamburg University of Technology
• A.-P. Fonseca-Müller, Bosch Sensortec GmbH
• M. Gössel, University of Potsdam
• S. Hellebrand, Paderborn University
• K. Hofmann, Technical University of Darmstadt
• S. Holst, Kyushu Institute of Technology
• W. Hoppe, Rheinmetall AG
• F. Hopsch, Fraunhofer IIS EAS Dresden
• S. Huhn, University of Bremen and DFKI GmbH
• R. Krenz-Baath, Hamm-Lippstadt UAS

• M. Krstic, University of Potsdam and IHP GmbH
• V. Petrovic, Robert Bosch GmbH
• I. Polian, University of Stuttgart
• F. Pöhl, Apple Inc.
• S. Sattler, University Erlangen-Nürnberg
• M. Sauer, Advantest Europe GmbH
• M. Schillinsky, NXP Semiconductors Germany GmbH
• J. Schlöffel, Siemens Digital Industries Software
• H. Schmidt, IBM Deutschland GmbH
• M. Schölzel, Nordhausen University of Applied Sciences
• J. Sepulveda, Airbus Defence and Space
• M. Tahoori, Karlsruhe Institut of Technology (KIT)
• D. Tille, Infineon Technologies AG
• M. Wahl, University of Siegen
• H.-J. Wunderlich, University of Stuttgart